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 ESW's Resistance Bonders are designed for the production floor and are intended for use with armatures, stators, fields and coils. They are fully automatic bonders. No operator decisions are necessary. The information needed is the resistance range of the part and the temperature at which the bond coat will activate. Everything else is automatically measured and calculated.
ESW bonders can either be sold as a complete package for integrating both testing and bonding at one station or as a stand-alone bonding system. Systems can be used on manual or automatic lines. The ESW Resistance Bonder utilizes a precise, computer-controlled DC power supply to provide bonding power to the part. We feel that the DC power produces a better bonding result than the use of the less expensive AC power. |
ESW's Wire Bonding process uses the resistance reading of the coil to determine the temperature of the coil. Prior to bonding, on every part, the temperature and the resistance is measured. The cutoff resistance is calculated based on the bond coat activation temperature. Resistance is easy to calculate when measuring DC voltage and current. Performing this calculation is more complicated with AC power because the inductance of the part must be known and any changes in the inductance will cause errors.
After the resistance cutoff limit has been determined, DC power is applied to the part causing the wire to heat up and thermoplastic layer to soften. The application of power to the part is done as quickly as possible to minimize the heating effects to the entire part. Using DC power is also advantageous because it takes less DC voltage than AC voltage to put the same amount of power into the part resulting in less stress on the part during bonding.
While the coils are heating up, the resistance is continuously measured and monitored. When the target resistance is reached, which indicates that the established bonding temperature has been reached, the power is removed. The thermoplastic layer, on the wire, "bonds" (the wires) together as the part cools.
The size of the power supply (voltage & current), contact resistance at the connection to the winding, tests performed and the cooling effects of the holding and forming tool can affect the time required to complete this process.
The process of testing, bonding and retesting provides complete handling of the part in one fixture. Manufacturers are able to accomplish the testing and bonding processes in as little as 5 seconds, thereby, increasing the overall workflow. (The size of the power supply (voltage & current), contact resistance at the connection to the winding, tests performed and the cooling effects of the holding and forming tool can affect the time required to complete this process.)
The tester/bonders sequence through electrical tests, which can consist of resistance, surge and hipot, depending on your individual needs. Immediately upon completion of those tests the bonding cycle will begin. The bond cycle will only occur when a “good” part signal is received from the tester. Upon receipt on an “end of bond” signal a final surge or hipot test can be performed. Bonding may also be performed in the manual mode of operation.
Stator/Bonder Test
Systems
Armature/Bonder Test Systems
Stand-Alone
Resistance Bonders
Workstations
Advantages of using Bondable Wire
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